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Horizontal Pulse Cu-Filling SkyPlate Cu658
Classification:
Plating
Hotline:
Product Description
▍Product Overview:
● Horizontal pulse Cu-plating with insoluble anodes for via filling
● Blind vias filled with 6-12μm of plated surface copper
● Good physical properties
● Current density range: 4-6ASD
● Plating additives analyzable by CVS
▍Product Features:
Blind hole diameter: 90μm, dielectric thickness: 45μm
, average current density ~4.7ASD
plating thickness 8-10μm, Dimple <5μm
Blind hole diameter: 100μm, dielectric thickness: 60μm
, average current density ~4.8ASD
plating thickness 8-10μm, Dimple <5μm
Blind hole diameter: 120μm, dielectric thickness: 70μm
, average current density ~5ASD
plating thickness 8-10μm, Dimple <5μm
Reflow test:
30 times without copper breakage, corner cracking, or copper layer separation
SEM observation: No lattice defects
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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