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VCP DC Via-Fill Cu-plating SkyPlate VF 6382
Classification:
Plating
Hotline:
Product Description
▍Product Overview:
● VCP Cu-plating with soluble and insoluble anodes for via filling
● via filling together with through hole plating
● Good physical properties
● Stable filling performance during bath lifetime
● Plating additives analyzable by CVS
▍Product Features:
Through hole 1.5/0.3mm TP%(min): 65%
Insoluble anode, electroplating 18μm;
Blind hole diameter: 100μm,
介厚：70μm; Dimple <5μm
SEM observation: No lattice defects
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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