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Horizontal Pulse Cu-plating SkyPlate Cu657
Classification:
Plating
Hotline:
Product Description
▍Product Overview:
● Horizontal pulse Cu-plating with insoluble anodes
● Good copper crystal structure and physical properties
● High current density: 4-10ASD
● Good TP for through hole and micro via plating
● Plating additives analyzable by CVS
▍Product Features:
Blind hole thickness 60μm, aperture 140μm
average current density 5ASDX8 minutes
flash plating normal, no crab feet
TP% (min): 100%
Plate thickness 1.5mm, pore diameter 0.25mm, AR=6:1
average current density 8ASDX21 minutes
TP% (min): 90%
Plate thickness 1.6mm, pore diameter 0.25mm AR=6.4:1
Average current density 6.5ASDX5 minutes
TP% (min): 110%
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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