About Skychem
About us
Focus on technical innovation of chemical deposition, electrochemical deposition and interface treatment.
It is one of the most professional leading industries in related fields at home and abroad.
Stock Code 688603
R & D personnel
Authorized patent
Maximum capacity
In 2023 successfully landed on the board, stock code 688603, the company focuses on chemical deposition, electroplating and copper surface treatment and other technical fields, the company's research and development technical team deep-cultivated related industry technology for more than 30 years, is the domestic professional chemical deposition and electroplating additives research and development leader. In the field of PCB has been comparable with international counterparts, in the electronic circuit industry has won recognition and reputation, products are widely accepted by customers. The chemical copper deposition technology and product performance applied in PI, PET, ABF and various adhesive film materials are reliable, and are approved by mainstream packaging carrier manufacturers and head OEM, and the glass substrate TGV is filled with copper plated products.
Skychem Technology Products
Functional wet electronic chemicals for advanced packaging
Excellent uniformity across the entire sheet
Insoluble anode, VCP fills blind holes, X-shaped holes and through holes; can be DC or pulse filled; good physical properties, no chemical scratches. Low circuit curvature and good uniformity; compared with DC filling, with appropriate equipment and parameters, it can be used to produce multilayer boards, carrier boards and other types of packaging circuit boards, suitable for chemical debonding in SLP & mSAP processes.
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Electronic chemicals for touch screen
Touch screen copper
Insoluble anode, VCP fills blind holes, X-shaped holes and through holes; can be DC or pulse filled; good physical properties, no chemical scratches. Low circuit curvature and good uniformity; compared with DC filling, with appropriate equipment and parameters, it can be used to produce multilayer boards, carrier boards and other types of packaging circuit boards, suitable for chemical debonding in SLP & mSAP processes.
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Electronic chemicals for substrates
Additives can be analyzed by CVS
Insoluble anode, VCP fills blind holes, X-shaped holes and through holes; can be DC or pulse filled; good physical properties, no chemical scratches. Low circuit curvature and good uniformity; compared with DC filling, with appropriate equipment and parameters, it can be used to produce multilayer boards, carrier boards and other types of packaging circuit boards, suitable for chemical debonding in SLP & mSAP processes.
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Special electronic chemicals for copper surface treatment
Environmentally friendly stripping rack product that replaces nitric acid
Insoluble anode, VCP fills blind holes, X-shaped holes and through holes; can be DC or pulse filled; good physical properties, no chemical scratches. Low circuit curvature and good uniformity; compared with DC filling, with appropriate equipment and parameters, it can be used to produce multilayer boards, carrier boards and other types of packaging circuit boards, suitable for chemical debonding in SLP & mSAP processes.
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Special electronic chemicals for electroplating
Horizontal Insoluble Anode Pulse Via Filling Copper Plating
Insoluble anode, VCP fills blind holes, X-shaped holes and through holes; can be DC or pulse filled; good physical properties, no chemical scratches. Low circuit curvature and good uniformity; compared with DC filling, with appropriate equipment and parameters, it can be used to produce multilayer boards, carrier boards and other types of packaging circuit boards, suitable for chemical debonding in SLP & mSAP processes.
More
Electronic chemicals for horizontal copper deposition
Hole Metallization Horizontal Copper Plating
Insoluble anode, VCP fills blind holes, X-shaped holes and through holes; can be DC or pulse filled; good physical properties, no chemical scratches. Low circuit curvature and good uniformity; compared with DC filling, with appropriate equipment and parameters, it can be used to produce multilayer boards, carrier boards and other types of packaging circuit boards, suitable for chemical debonding in SLP & mSAP processes.
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sh688603
Shanghai Stock Exchange (sh) Shenzhen Stock Exchange (sz) Venture (sz) New Third Board (sh) North Stock Exchange (bj) Hong Kong Stock Exchange (hk) US Stock (us)
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Focus on science and technology, serve the public, and achieve perfection.
Investor Relations
Focus on science and technology, serve the public, and achieve perfection.
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SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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