Focus On R&D And Production
VCP Pulse Cu-plating SkyPlate Cu6257
Classification:
Plating
Hotline:
Product Description
▍Product Overview:
● VCP pulse Cu-plating with insoluble anodes for through hole plating
● Good copper crystal structure and physical properties
● High current density:2.5-6ASD
● Use pure copper, cost saving
● Additives analyzable by CVS
▍Product Features:
Plate thickness 1.5mm, pore diameter 0.2mm
Average current density
3.6ASDX50min
TP% (min): 100%
Reflow test results:
30 times without copper breakage, corner cracking, or copper layer separation
SEM observation: No lattice defects
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
Scan and follow us
More exciting is waiting for you!