Focus On R&D And Production
Product Description
▍Product Overview:
● VCP Cu-plating additive for both soluble and insoluble anodes
● Excellent levelling performance
● High throwing power and good physical properties
● Wide current density window of 1-3ASD
● Additives analyzable by CVS
▍Product Features:
Blind hole diameter 120μm, dielectric thickness 70μm
electroplating 2ASDX60 minutes
TP% >100%
SkyPlate Cu622 copper plating crystal structure
SEM observation: No crystal defects
1.5mm board thickness, 0.25mm aperture
electroplating 2.2ASDX50 minutes
TP%(min): 85.4%
2.4mm board thickness, 0.3mm aperture
electroplating 1.8ASDX70 minutes
TP%(min): 71%
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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