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IC Substrate Via-Fill cu-plating SkyStrate HF
Classification:
Carrier Board Specialty Chemicals
Hotline:
Product Description
▍Product Overview:
● VCP pulse Cu-via filling with insoluble anodes for throgh hole, X hole, and blind micro via
● Good physical properties
● Via filling with good throwing power for through holes
● Thinner copper plating thickness
● Plating additives analyzable by CVS
▍Product Features:
Through-blind co-plating
blind hole Aperture 100μm, dielectric thickness 80μm
electroplating 15μm, fill
through hole 1.6/0.25mm
TP%(min) ：85%
Through hole
diameter 100μm, dielectric thickness 300μm,
pulse plating 40μm, fill
Through hole
diameter 150μm, dielectric thickness 580μm,
pulse plating 45μm, depression 10μm
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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