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IC Substrate Via-Fill cu-plating SkyStrate VF
Classification:
Carrier Board Specialty Chemicals
Hotline:
Product Description
▍Product Overview:
● VCP Cu-via filling with insoluble anodes for blind micro via, X hole, and throgh hole
● DC and pulse plating via filling
● Good physical properties, no chemical scratch
● Low convex, good uniformity
● Plating additives analyzable by CVS
▍Product Features:
Blind hole
diameter 80μm, dielectric thickness 60μm,
electroplating 13μm, filled
X-type hole
diameter 70μm, dielectric thickness 100μm,
electroplating 16μm, filled, no core
Blind hole
diameter 125μm, dielectric thickness 80μm,
electroplating 18μm, filled
Through hole
diameter 100μm,
dielectric thickness 350μm, pulse plating 30μm, filled, no core
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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