Focus On R&D And Production
TSV Copper Filling SkyFab TSV8
Classification:
Advanced Packaging
Hotline:
Product Description
▍Produc Overview:
● Good filling performance for high AR (~10) through silicon via
● Thin plating thickness and low protrusion after annealing
● Low organicimpurity in deposition
● Low stress deposition with high ductility and tensile stress
● Plating additives analyzable by CVS
▍Product Features:
Aperture 75 µm, depth 360 µm, AR～5
Aperture 6 µm, depth 75 µm, AR～12
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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