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TGV Cu Plating SkyFab THF8
Classification:
Advanced Packaging
Hotline:
Product Description
▍Product Overview:
● Designed for TGV plating
● Compatible for both pulse and DC plating
● Excellent via filling capability
● Low stress deposition with high ductility and tensile stress
● Plating additives analyzable by CVS
▍Produc Features:

Pore diameter 40µm, dielectric thickness 400µm after bridging

Medium thickness 400µm, pore size 40µm

FIB observation: No crystal defects