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Product Description
Horizontal Electroless Cu
SkyCopp 3652S1 Series
丨Product introduction:
● Suitable for FPCs，especially cladded with RA or HA copper foils, resolving the roughness issue on RA and HA foils which occurs after electroless Cu and Cu-plating
● Specialized PI conditioner can effectively roughen PI substrate, promoting adsorption of conditioning agent on PI surface on hole walls in the following conditioning process
● Ionic Pd activation, high wetting ability for blind vias and small through holes, especially suitable for HDI boards
● More environmentally friendly, copper bath contains no poisonous cyanide
● Low stress copper deposit and excellent adhesion, outstanding reliability, no blistering issue on coverlay material
丨Performance:
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blistering |
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adhesion |
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coverage |
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FIB-SEM |
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Performance |
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Hot oil |
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Solder float (288℃ * 10cycles） |
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Constant temperature and humidity |
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Thermal shock |
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Excellent performance, smooth and shiny Cu surface after Cu-plating, no roughness issue
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SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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