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Product Description
Horizontal Electroless Cu
SkyCopp 3652 Series
丨Main features:
● Suitable for fabrication of Flexible,Rigid-Flex PCBs and IC substrates
● Specialized PI conditioner can effectively roughen PI substrate, promoting adsorption of conditioning agent on PI surface on hole walls in the following conditioning process
● Ionic Pd activation, high wetting ability for blind vias and small through holes, especially suitable for HDI boards
● More environmentally friendly because the copper bath is free of poisonous cyanide
● Low stress copper deposit, excellent adhesion, no blistering issue on cover-lay material
丨Performance:
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Item |
Performance |
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Coverage |
Excellent coverage in PI open area/CL/hole wall, no blistering issue |
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Physical property - Hot oil + Baking |
288℃ * 20min + Baking 300℃ * 20min No ICD |
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Item |
Performance |
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physical property - IR reflow |
IR reflow * 6 cycles No ICD |
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Physical property - Solder float |
288℃ * 10sec 10 cycles No ICD |
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