Focus On R&D And Production
Bumping Cu Plating SkyFab CP50
Classification:
Advanced Packaging
Hotline:
Product Description
▍Product Overview:
● Developed for copper pillar plating, appliable current density up to 20 ASD
● Good uniformity and coplanarity
● Low impurity in deposition
● Low stress, high ductility and tensile stress
● Plating additives analyzable by CVS
▍Product Features:
Copper pillar deposition current: 5ASD (10 µm) + 12ASD (110 µm)
Copper pillar deposition current: 6ASD (5 µm) + 14ASD (40 µm)
SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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