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Product Description
DC Via Filling
SkyPlate VF 6382
丨Main Features:
● Skyplate VF 6382 is a DC via filling copper plating process, suitable for VCP and traditional hoist type plating lines with either soluble or insoluble anodes
● Excellent performance for BMV filling, also compatible for through hole plating
● Excellent chemical stability
● Compatible with via filling process directly after PTH or after flash plating
● Additives can be analyzed by CVS method
丨Application:
SkyPlate VF 6382 is suitable for HDI via filling with thru holes plating in the same time
MBV：Diameter≤ 150 μm , Depth≤80um
Through Hole： thickness≤ 1.2mm， A/R ≤ 5:1
Surface copper <20 μm
Filled vias Dimple≤ 10 μm
Through hole throwing power about 70%
丨Plating Performance:
Hole size 150um Hole Depth 115um
Plating thickness 25um Dimple 10um
Hole size 115um Hole Depth 75um
Plating thickness 20um Dimple 5um
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SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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