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Product Description
Horizontal Electroless Cu
SkyCopp 365SP Series
丨Main features:
● Low stress copper deposit and excellent adhesion make SkyCopp 365SP outstanding PTH reliability
● Suitable for PCBs with high demand of reliability, such as those used in automobile and 5G products
For products with high reliability requirements, the palladium concentration is recommended to be higher than that of ordinary products;
● Ionic Pd activation with low surface tension
● Two stabilizers are employed in SkyCopp 365SP copper bath with adjustable addition ratio to suit different equipment
● Perfectly applicable in horizontal equipment
丨Performance:
|
Item |
Performance |
Image |
|
Backlight |
Excellent hole wall coverage |
 |
|
Physical properties - IR + Solder float |
IR reflow * 5 cycles + 288℃ * 10sec 5 cycles No ICD |
 S1000H |
|
Item |
Performance |
Image |
|
Physical property - Solder float |
288℃ * 10sec 15 cycles No ICD |
 |
|
Physical property - IR + Solder float |
IR reflow * 5 cycles + 288℃ * 10sec 5 cycles No ICD |
 EM827 |
SkyCopp 365SP: excellent coverage, great physical properties and good bath stability
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SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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