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Product Description
Horizontal Insoluble Anode Pulse
Copper Via Filling Plating Process
SkyPlate Cu658
丨Introduction:
● SkyPlate Cu 658 is a pulse copper plating additive system for via filling application in horizontal conveyorized equipment with insoluble anode
● Plating solution contains a special redox couple to realize electron exchange, avoiding oxygen evolution on the insoluble anode
● The ion of the oxidized state of the redox couple can dissolve Copper. Cu ions in the plating solution is replenished by adding pure Cu nuggets in a Cu dissolving tank outside the main plating tank.
● Excellent filling performance(hole size:100-120 µm/via hole depth:50-80 µm, dimple<5 µm)
● Very thin copper plating on PCB surface (8-12 µm)
● Short plating time (20-35min), thus high productivity
● Deposit has good physical properties
丨Performance:
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SkyChem Technology/SkyChem Chemical was established in 2010, dedicated to the research and development and manufacturing of high-end special electronic materials in the printed circuit board, semiconductor and packaging, and touch screen industries.
No. 280, Hualian 3rd Road, Nanshui Town, Jinwan District, Zhuhai City
020-87818339
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