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SkyPlate Cu658

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SkyPlate Cu658

Product description

Parameters

Horizontal Insoluble Anode Pulse
Copper Via Filling Plating Process
SkyPlate Cu658

丨Introduction:

● SkyPlate Cu 658 is a pulse copper plating additive system for via filling application in horizontal conveyorized equipment with insoluble anode
● Plating solution contains a special redox couple to realize electron exchange, avoiding oxygen evolution on the insoluble anode
● The ion of the oxidized state of the redox couple can dissolve Copper. Cu ions in the plating solution is replenished by adding pure Cu nuggets in a Cu dissolving tank outside the main plating tank.
● Excellent filling performance(hole size:100-120 µm/via hole depth:50-80 µm, dimple<5 µm)
● Very thin copper plating on PCB surface (8-12 µm)
● Short plating time (20-35min), thus high productivity
● Deposit has good physical properties

丨Performance: