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SkyPlate Cu6255

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SkyPlate Cu6255

Product description
Parameters

Soluble Anode Pulse Copper Plating
SkyPlate Cu6255

Features:

● A soluble anode pulse copper plating process
● Suitable for through hole and BMV boards conformal plating
● Excellent throwing power, good for high aspect ratio PCB plating
● Greater productivity with higher applicable current density then DC plating
● Deposit has good physical properties
● SkyPlate Cu6255 additives are CVS analyzable

 

Performance:

Board thickness: 2.1mm
Hole diameter: 0.25mm
Average current density : 2.3ASD
Plating time: 60min
TPmin:96.9%

Board thickness: 4.0mm
Hole diameter: 0.25mm
Average current density : 2.0ASD
Plating time: 60min
TPmin:100.9%

Copper Crystal Structure:

We could not find any corresponding parameters, please add them to the properties table
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Suzhou SkyChem Chemical Co., Ltd.

Add : 1088 Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province

Cod:215000

Tel: +86 512-66980851

Fax:+86 512-66980853

 

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