SkyPlate Cu6255
Soluble Anode Pulse Copper Plating
SkyPlate Cu6255
丨Features:
● A soluble anode pulse copper plating process
● Suitable for through hole and BMV boards conformal plating
● Excellent throwing power, good for high aspect ratio PCB plating
● Greater productivity with higher applicable current density then DC plating
● Deposit has good physical properties
● SkyPlate Cu6255 additives are CVS analyzable
丨Performance:
Board thickness: 2.1mm
Hole diameter: 0.25mm
Average current density : 2.3ASD
Plating time: 60min
TPmin：96.9%
Board thickness: 4.0mm
Hole diameter: 0.25mm
Average current density : 2.0ASD
Plating time: 60min
TPmin：100.9%
丨Copper Crystal Structure:
Scan and follow us
More exciting is waiting for you!
Suzhou SkyChem Chemical Co., Ltd.
Add : 1088 Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province
Cod：215000
Tel： +86 512-66980851
Fax：+86 512-66980853
© 2020 Suzhou SkyChem Technology Co., Ltd. Copyright All rights reserved 苏ICP备88888888号