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Horizontal Mode

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Horizontal Mode

Product description
Parameters

Horizontal Mode SkyPosit Sn955

Main features:

 ● Stable Process

 ● Tin whisker growth inhibited

 ● Uniform surface appearance

 ● Excellent solderability

 ● Applicable to horizontal equipment

 

Solderability test:

Solder paste printed

 

Printed directly

 

Printed after 1x reflow

Excellent Solderability

Tin Whisker Growth :

Performance of tin whisker inhibitor SkyPosit Sn955S:

 

 

Tin whiskers within 30days without inhibitor

 

No tin whisker within 30 days with inhibitor

 

Inhibitor SkyPosit Sn955S highly effective

 

 

Tin Thickness :

Deposition rate VS Cu2+ and SkyPosit Sn955S concentration

 

Stable tin thickness at different concentrations of Cu2+ and SkyPosit Sn955S

 

Vertical vs Horizontal:

Vertical Mode

 

 

Performance  


Excellent solderability

Super uniform tin layer

Tin whisker inhibited

Cost  

 

Equipment less expensive
Electricity consumption lower
Smaller space needed
Maintenance simple
Operation easy
Smaller bath

Others

 

Less Good working environment
More difficult for automation

Horizontal Mod

 

 

Performance  


Excellent solderability

Super uniform tin layer

Tin whisker inhibited

Cost  

 

Higher equipment cost

Electricity consumption higher

Larger space needed

Maintenance complicated

Operation sophisticated

Bigger bath

Others

 

Better working environment
Easier for automation

Performance of both vertical and horizontal mode are good, Customer selects process mode according to their concrete requirements and situation

 

We could not find any corresponding parameters, please add them to the properties table
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Suzhou SkyChem Chemical Co., Ltd.

Add : 1088 Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province

Cod:215000

Tel: +86 512-66980851

Fax:+86 512-66980853

 

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