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Hole metallization

SkyCopp 360 Series

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SkyCopp 360 Series

Product description

Parameters

Vertical Electroless Cu
SkyCopp 360 Series

丨Main features:

● SkyCopp 360 is a low build PTH process at low temperature based on EDTA complexing agent, yielding 15~25u" deposit in 15-25 minutes, suitable for vertical equipment
● Colloid Pd activation with low Pd concentration
● Used in conventional hoist type equipment with racks or baskets
● Cost effective

丨Performance :

Item	Performance	Image
Coverage- Backlight	Excellent hole wall coverage
Coverage- daisy chain connectivity	Excellent connectivity	Daisy Chain with 80 thousand holes, AR=10:1

Item	Performance	Image
Physical property - Solder Float	288℃ * 10sec 6 cycles No ICD
Physical property - IR reflow	IR Reflow * 6 cycles No ICD