1
Language
Focus on R&D and production
Committed to the research and development and manufacturing of high-end special electronic
Location:
Homepage
/
/
/
SkyCopp 365SP Series

Products

SkyCopp 365SP Series

Product description
Parameters

Horizontal Electroless Cu
SkyCopp 365SP Series

 

Main features:

● Low stress copper deposit and excellent adhesion make SkyCopp 365SP outstanding PTH reliability
● Suitable for PCBs with high demand of reliability, such as those used in automobile and 5G products For products with high reliability requirements, the palladium concentration is recommended to be higher than that of ordinary products;
● Ionic Pd activation with low surface tension
● Two stabilizers are employed in SkyCopp 365SP copper bath with adjustable addition ratio to suit different equipment
● Perfectly applicable in horizontal equipment

 

 

Performance:

 

Item

Performance

Image

Backlight

Excellent hole wall coverage

Physical properties - IR + Solder float

IR reflow * 5 cycles + 288℃ * 10sec 5 cycles No ICD


S1000H

 

Item

Performance

Image

Physical property - Solder float

288℃ * 10sec 15 cycles No ICD

Physical property - IR + Solder float

IR reflow * 5 cycles + 288℃ * 10sec 5 cycles No ICD


EM827

 

SkyCopp 365SP: excellent coverage, great physical properties and good bath stability

We could not find any corresponding parameters, please add them to the properties table
SkyChem

Scan and follow us

More exciting is waiting for you!

Suzhou SkyChem Chemical Co., Ltd.

Add : 1088 Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province

Cod:215000

Tel: +86 512-66980851

Fax:+86 512-66980853

 

© 2020 Suzhou SkyChem Technology Co., Ltd. Copyright All rights reserved      苏ICP备88888888号