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Hole metallization

SkyCopp 365SP Series

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SkyCopp 365SP Series

Product description

Parameters

Horizontal Electroless Cu
SkyCopp 365SP Series

丨Main features:

● Low stress copper deposit and excellent adhesion make SkyCopp 365SP outstanding PTH reliability
● Suitable for PCBs with high demand of reliability, such as those used in automobile and 5G products For products with high reliability requirements, the palladium concentration is recommended to be higher than that of ordinary products;
● Ionic Pd activation with low surface tension
● Two stabilizers are employed in SkyCopp 365SP copper bath with adjustable addition ratio to suit different equipment
● Perfectly applicable in horizontal equipment

丨Performance:

Item	Performance	Image
Backlight	Excellent hole wall coverage
Physical properties - IR + Solder float	IR reflow * 5 cycles + 288℃ * 10sec 5 cycles No ICD	S1000H

Item	Performance	Image
Physical property - Solder float	288℃ * 10sec 15 cycles No ICD
Physical property - IR + Solder float	IR reflow * 5 cycles + 288℃ * 10sec 5 cycles No ICD	EM827