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Hole metallization

SkyCopp 3651 Series

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SkyCopp 3651 Series

Product description

Parameters

Horizontal Electroless Cu
SkyCopp 3651 Series

丨Main features:

● SkyCopp 3651 is more environmentally friendly, copper bath is free of poisonous cyanide and nickel ions
● Ionic Pd activation, high wetting ability for blind vias and small through holes
● Rather low concentration of Pd ion is sufficient to activate normal boards, which is effective for cost control
● Relatively easy waste treatment thanks to tartrate complexing agent
● Able to deposit same copper thickness in 4-6 minutes compared to 15-25 minutes for vertical PTH process without sacrificing bath stability
● Rich experience in working with most brands of equipment in the market

丨Performance:

Item	Performance	Image
Backlight	Excellent hole wall coverage
Physical property - IR reflow	IR reflow *10 cycles No ICD

Item	Performance	Image
physical property - Solder float	288℃ * 10sec 6 cycles No ICD
Physical property - Solder float	288℃ * 10sec 6 cycles No ICD