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Hole metallization

SkyCopp 3652 Series

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SkyCopp 3652 Series

Product description

Parameters

Horizontal Electroless Cu
SkyCopp 3652 Series

丨Main features:

● Suitable for fabrication of Flexible，Rigid-Flex PCBs and IC substrates
● Specialized PI conditioner can effectively roughen PI substrate, promoting adsorption of conditioning agent on PI surface on hole walls in the following conditioning process
● Ionic Pd activation, high wetting ability for blind vias and small through holes, especially suitable for HDI boards
● More environmentally friendly because the copper bath is free of poisonous cyanide
● Low stress copper deposit, excellent adhesion, no blistering issue on cover-lay material

丨Performance:

Item	Performance	Image
Coverage	Excellent coverage in PI open area/CL/hole wall, no blistering issue
Physical property - Hot oil + Baking	288℃ * 20min + Baking 300℃ * 20min No ICD

Item	Performance	Image
physical property - IR reflow	IR reflow * 6 cycles No ICD
Physical property - Solder float	288℃ * 10sec 10 cycles No ICD