SkyCopp 3652S1 Series
Horizontal Electroless Cu
SkyCopp 3652S1 Series
丨Product introduction:
● Suitable for FPCs，especially cladded with RA or HA copper foils, resolving the roughness issue on RA and HA foils which occurs after electroless Cu and Cu-plating
● Specialized PI conditioner can effectively roughen PI substrate, promoting adsorption of conditioning agent on PI surface on hole walls in the following conditioning process
● Ionic Pd activation, high wetting ability for blind vias and small through holes, especially suitable for HDI boards
● More environmentally friendly, copper bath contains no poisonous cyanide
● Low stress copper deposit and excellent adhesion, outstanding reliability, no blistering issue on coverlay material
丨Performance:
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blistering |
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adhesion |
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coverage |
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FIB-SEM |
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Hot oil |
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Solder float (288℃ * 10cycles） |
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Constant temperature and humidity |
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Thermal shock |
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Excellent performance, smooth and shiny Cu surface after Cu-plating, no roughness issue
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Suzhou SkyChem Chemical Co., Ltd.
Add : 1088 Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province
Cod：215000
Tel： +86 512-66980851
Fax：+86 512-66980853
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