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SkyCopp 3652S1 Series

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SkyCopp 3652S1 Series

Product description
Parameters

Horizontal Electroless Cu
SkyCopp 3652S1 Series

 

Product introduction:

● Suitable for FPCs,especially cladded with RA or HA copper foils, resolving the roughness issue on RA and HA foils which occurs after electroless Cu and Cu-plating
● Specialized PI conditioner can effectively roughen PI substrate, promoting adsorption of conditioning agent on PI surface on hole walls in the following conditioning process
● Ionic Pd activation, high wetting ability for blind vias and small through holes, especially suitable for HDI boards
● More  environmentally friendly, copper bath contains no poisonous cyanide
● Low stress copper deposit and excellent adhesion, outstanding reliability, no blistering issue on coverlay material

 

 

Performance:

 

Item

Performance

blistering

adhesion

coverage

FIB-SEM

 

Item

Performance

Hot oil
(288℃*20min+
Bakig 300℃*20min)

Solder float (288℃ * 10cycles)

Constant temperature and humidity
(85℃/85%/8h)

Thermal shock
(-40℃~80℃ * 8h)

Excellent performance, smooth and shiny Cu surface after Cu-plating, no roughness issue

 

We could not find any corresponding parameters, please add them to the properties table
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Suzhou SkyChem Chemical Co., Ltd.

Add : 1088 Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province

Cod:215000

Tel: +86 512-66980851

Fax:+86 512-66980853

 

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