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SkyPlate FL Cu618

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SkyPlate FL Cu618

Product description
Parameters

Flexible PCB Direct Current

Copper Plating Process SkyPlate FL Cu618

Product introduction:

● SkyPlate FL Cu618 is DC copper plating additive system for flexible PCB fabrication.
● Suitable for VCP equipment with soluble or insoluble anodes.
● Suitable for flash plating or panel plating.
● Plating current density with wide range from 1.5 ASD to 3.0 ASD.

● High throwing power for flexible PCBs plating
● Deposit layer has excellent physical properties under operation parameters
● SkyPlate FL Cu618 additives can be analyzed with CVS.

Performance:

3.3ASD*25min,spray 35HZ
Board Thickness: 0.23mm
Hole Diameter: 0.15mm
TP>130%

2.0ASD*40min,spray 45HZ

TP>100%

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Suzhou SkyChem Chemical Co., Ltd.

Add : 1088 Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province

Cod:215000

Tel: +86 512-66980851

Fax:+86 512-66980853

 

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