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SkyPlate VF 6382

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SkyPlate VF 6382

Product description

Parameters

DC Via Filling

SkyPlate VF 6382

丨Main Features:

● Skyplate VF 6382 is a DC via filling copper plating process, suitable for VCP and traditional hoist type plating lines with either soluble or insoluble anodes
● Excellent performance for BMV filling, also compatible for through hole plating
● Excellent chemical stability
● Compatible with via filling process directly after PTH or after flash plating
● Additives can be analyzed by CVS method

丨Application:

SkyPlate VF 6382 is suitable for HDI via filling with thru holes plating in the same time
MBV：Diameter≤ 150 μm , Depth≤80um
Through Hole： thickness≤ 1.2mm， A/R ≤ 5:1
Surface copper <20 μm
Filled vias Dimple≤ 10 μm
Through hole throwing power about 70%

丨Plating Performance: