Focus On R&D And Production


SkyChem Technology will participate in the International Semiconductor Packaging and Testing Conference and Exhibition, and will launch RDL, Bumping, TSV electroplating copper related products for advanced packaging processes.

2024-02-22 09:35

2024 China International Semiconductor Packaging and Testing Conference

Registration is now open!

>>>>Time<<<<

March 18-19

>>>>Address<<<<

Held in the conference hall of Shanghai Pudong Greenland Holiday Hotel!

>>>>Scale<<<<

A new high will be reached in 2024! It is expected to reach 600 companies in total!

>>>>Exhibition Area<<<<

61 exhibition companies have been confirmed!

>>>>Participants<<<<

All of them are from upstream and downstream of the packaging and testing industry, and all the participants are real personnel!

>>>>Exclusive Benefits<<<<

Exclusive address book service

Exclusively provide distribution and analysis reports of over 1,300 packaging and testing companies

Exclusively provide distribution and analysis reports of over 180 advanced packaging companies

....................